Industrial furnaces play a crucial role in the preparation of "calcium-based metal" materials.

"Computing Power Metals" fall into two main categories

    The first category is the "skeleton-building" base metals for AI computing power—copper and aluminum. Copper and aluminum serve as the "blood vessels" of data centers. They are responsible for both powering servers and dissipating heat. Take copper as an example: an ordinary server uses only a few kilograms of copper, while a dedicated AI training "super server" can consume 15 to 30 kilograms of copper—three to six times more than the former.

    The second category is the "trace elements" that provide critical auxiliary support for AI computing power—tin, indium, germanium, gallium, etc. Tin is primarily used for soldering between chips and circuit boards. The more advanced the packaging technology, the greater the reliance on tin. Indium, germanium, and gallium are core materials for optical communications and power management modules, ensuring high-speed light transmission and stable power supply. Ruthenium and cobalt are used in hard disk data storage and high-performance chip manufacturing, among other fields.

Industrial furnaces are the critical equipment for the preparation of "computing power metal" materials.

   Take tin as an example. It is an ideal material for micron‑sized solder joints on chips, and the tin consumption of an AI server can be more than three times that of a conventional server. However, this "computing power metal" is not inherently ready for chip packaging. It must undergo high‑purity smelting and processing, and the key heat‑treatment steps in this process are exactly what various industrial furnaces are needed to accomplish.

Industrial furnaces are the "core machine tools" for AI computing hardware manufacturing.

   In the AI era, the manufacturing of computing hardware—from chips themselves to servers and liquid cooling systems—relies on a variety of high‑performance industrial furnaces at every stage, including chip packaging and circuit board soldering, liquid cooling system manufacturing, and semiconductor material preparation and processing.

   Thus, industrial furnaces not only serve to prepare "computing power metals" (such as tin) themselves, but also act as essential core equipment for manufacturing computing hardware (chips, circuit boards, and cooling systems).